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HYF2GQ4UTDCAE Datasheet Download HeYangTek

Download HeYangTek NAND FLASH
Part Information Full electrical specs per datasheet
Part Number
HYF2GQ4UTDCAE
Brand
HeYangTek
Series
HYF2GQ
Category
Memory / NAND FLASH
Package
LGA8

SPI NAND 2Gb

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Key Parameters 3 items · per datasheet
Capacity2Gb
InterfaceQSPI;Dual SPI
Operating Temp.-40~+85°C
Alternative Parts 6 candidates · auto-compared by subcategory & key parameters
Part NumberBrandVerdictKey Parameter ComparisonDatasheet
GD5F2GM7GigaDeviceFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 2Gbit → 2GbitInterface QSPI/SPI → QSPI/SPIPackage LGA8 → WSON-8(6x8)
Download
GD5F2GM7REBIGGigaDeviceFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 2Gbit → 2GbitInterface QSPI/SPI → QSPI/SPIPackage LGA8 → WSON-8(6x8)
Download
GD5F2GM7REWIGGigaDeviceFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 2Gbit → 2GbitInterface QSPI/SPI → QSPI/SPIPackage LGA8 → WSON-8(6x8)
Download
GD5F2GM7REYIGGigaDeviceFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 2Gbit → 2GbitInterface QSPI/SPI → QSPI/SPIPackage LGA8 → WSON-8(6x8)
Download
GD5F2GM7REYJGGigaDeviceFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 2Gbit → 2GbitInterface QSPI/SPI → QSPI/SPIPackage LGA8 → WSON-8(6x8)
Download
GD5F2GM7UEBIGGigaDeviceFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 2Gbit → 2GbitInterface QSPI/SPI → QSPI/SPIPackage LGA8 → WSON-8(6x8)
Download

The verdict is based on public parameters only (capacity/interface/package/pins/speed); timing margins, temperature grades, certifications and lot differences are not covered. Confirm with both datasheets before replacing; ask us for samples or validation support.

Pre-replacement Checklist (NAND FLASH)
  1. Page/block size & organization (2K+64B, 4K+256B, etc.)
  2. ECC scheme (on-die vs controller, sufficient strength)
  3. Bad-block management & max factory bad blocks
  4. ONFI/timing modes compatibility with the controller
  5. Cell type (SLC/MLC/TLC), endurance & retention
  6. Package & pad definition

These are standard checkpoints for this product type. Verify each item and pilot-test before full switch-in. Ask us for samples, a replacement assessment report or FAE support - free samples and validation assistance provided.

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