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W74M12JWZPIQ Datasheet Download Winbond

Download Winbond NAND FLASH
Part Information Full electrical specs per datasheet
Part Number
W74M12JWZPIQ
Brand
Winbond
Series
W74M
Category
Memory / NAND FLASH
Package
WSON-8(5x6)

W74M12JWZPIQ TR

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Key Parameters 4 items · per datasheet
Capacity128Mbit
InterfaceSPI
Frequency (fc)104MHz
Supply Voltage1.7V~1.95V
Alternative Parts 6 candidates · auto-compared by subcategory & key parameters
Part NumberBrandVerdictKey Parameter ComparisonDatasheet
W74M12JWSSIQ TRWinbondFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 128Mbit → 128MbitInterface SPI → SPIVoltage 1.7~1.95V → 1.7~1.95VPackage WSON-8(5x6) → SOIC-8-208mil
Download
W74M12JWZEIQWinbondFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 128Mbit → 128MbitInterface SPI → SPIVoltage 1.7~1.95V → 1.7~1.95VPackage WSON-8(5x6) → WSON-8(6x8)
Download
W74M12JWZEIQ TRWinbondFunction-compatibleSame capacity/interface, different package — board change needed
Capacity 128Mbit → 128MbitInterface SPI → SPIVoltage 1.7~1.95V → 1.7~1.95VPackage WSON-8(5x6) → WSON-8(6x8)
Download
GD5F1GM7GigaDeviceUpgradeHigher capacity, works but may cost more
Capacity 128Mbit → 1GbitInterface SPI → QSPI/SPIVoltage 1.7~1.95V → 1.7~2VPackage WSON-8(5x6) → WSON8(6x8)
Download
GD5F1GM7REBIGGigaDeviceUpgradeHigher capacity, works but may cost more
Capacity 128Mbit → 1GbitInterface SPI → QSPI/SPIVoltage 1.7~1.95V → 1.7~2VPackage WSON-8(5x6) → WSON8(6x8)
Download
GD5F1GM7REWIGGigaDeviceUpgradeHigher capacity, works but may cost more
Capacity 128Mbit → 1GbitInterface SPI → QSPI/SPIVoltage 1.7~1.95V → 1.7~2VPackage WSON-8(5x6) → WSON8(6x8)
Download

The verdict is based on public parameters only (capacity/interface/package/pins/speed); timing margins, temperature grades, certifications and lot differences are not covered. Confirm with both datasheets before replacing; ask us for samples or validation support.

Pre-replacement Checklist (NAND FLASH)
  1. Page/block size & organization (2K+64B, 4K+256B, etc.)
  2. ECC scheme (on-die vs controller, sufficient strength)
  3. Bad-block management & max factory bad blocks
  4. ONFI/timing modes compatibility with the controller
  5. Cell type (SLC/MLC/TLC), endurance & retention
  6. Package & pad definition

These are standard checkpoints for this product type. Verify each item and pilot-test before full switch-in. Ask us for samples, a replacement assessment report or FAE support - free samples and validation assistance provided.

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